DISCO Corporation

Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website provides overall corporate information of DISCO such as the variety of products and technical information on the semiconductor manufacturing equipment…

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Disco Corporation Equipment For Qrindinq Of. Disco Corporation Equipment For Qrindinq Of About DISCO DISCO HITEC EUROPE It is the right place for needs related to the sale or maintenance of any dicing machine and blades grinding equipment laser cutter DISCO Corporation See …

disco corporation equipment for qrindinq of

disco corporation equipment for qrindinq of. About DISCO: DISCO HITEC EUROPE . It is the right place for needs related to the sale or maintenance of any dicing machine and blades, grinding equipment, laser cutter, DISCO Corporation. learn more

DISCO Corporation | SEMI

DISCO Corporation. Join Date: Jan 1, 1976. Company ID: 10462. Dicing equipment; grinding equipment and related consumables for materials processing. Primary Industry. Semiconductor. Primary Product Category. Equipment and Sub-Systems. Primary Product Sub Category.

Used Wafer Grinders | Buy & Sell | EquipNet

EquipNet is the world's leading provider of used wafer grinders and various other pre-owned equipment. Our exclusive contracts with our clients yield a wide range of used wafer grinders from a number of respected OEMs, including Disco Corporation and many others. We are constantly receiving used wafer grinders in a range of models and styles.

servicing disco grinding equipment

Grinding - LinkedIn SlideShare. Aug 26, 2015· Grinding 1. Grinding and Grinding Machine 2. Grinding: Grinding is a process of removing material by abrasive action of a revolving wheel on the surface of a work-piece in order to bring it to required shape and size The wheel used for performing the grinding operation is known as grinding wheel It consists of sharp crystal called abrasive held ...

Dicing and Grinding Service - Disco Corporation

This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai) and DISCO HI-TEC AMERICA(San Jose). It is also possible to provide these services with machines that are not shown here.

Solutions - DISCO Corporation

The chargeable processing service, which DISCO is providing, is in response to the demand for small-lot production, but where purchasing precision equipment is not practical. This service is effective for manufacturing samples when developing a new product or prototype, providing process technology or supporting small-lot production.

DISCO Corporation

Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website offers a wide range of product and technology information related to our semiconductor processing equipment and information regarding our buyback and resale of used semiconductor equipment.Investor relations, careers, and DISCO corporate information is also …

Product Information | Grinder and Polisher - DISCO …

Grinders can thin silicon wafers, compound semiconductors, and many other types of materials with a high degree of accuracy. Processing for applications which use the DBG system or DAF (Die attach film) is also possible by incorporating a polisher and wafer mounter with the grinder into an inline system*.

DISCO Corporation | SEMI

DISCO Corporation. Join Date: Jan 1, 1976. Company ID: 10462. Dicing equipment; grinding equipment and related consumables for materials processing. Primary Industry. Semiconductor. Primary Product Category. Equipment and Sub-Systems. Primary Product Sub Category.

servicing disco grinding equipment

Grinding - LinkedIn SlideShare. Aug 26, 2015· Grinding 1. Grinding and Grinding Machine 2. Grinding: Grinding is a process of removing material by abrasive action of a revolving wheel on the surface of a work-piece in order to bring it to required shape and size The wheel used for performing the grinding operation is known as grinding wheel It consists of sharp crystal called abrasive held ...

Dicing Before Grinding (DBG) | DISCO Technology …

In DBG, first a half-cut is performed on the wafer with a dicing saw. Then, wafer thinning and die separation are performed at the same time during grinding. Because the thinned wafers are never transferred in DBG, wafer-level breakage is greatly reduced.

Thin Wafer Processing and Dicing Equipment Market …

Jun 12, 2020· – TAIKO, developed by DISCO Corporation, is a wafer back grinding process that uses a new grinding method. It is used for reducing the risk of thin wafer handling and lowering the warpage. The grinding process in TAIKO leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference.

Disco Corporation - Wikipedia

DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage ...

DISCO precision machines - dicing-grinding service

Best Equipment for advanced Dicing-Grinding Service. DISCO’s high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.

Dicing and Grinding Service - Disco Corporation

This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai) and DISCO HI-TEC AMERICA(San Jose). It is also possible to provide these services with machines that are not shown here.

Dicing and Grinding Using the ... - Disco Corporation

Process Workflow 1: Processing by Each Equipment (Stand-Alone) (Each step is performed by stand-alone equipment) Protective tape (BG tape for backside grinding) is laminated onto the wafer surface’s circuit, the backside of the wafer is ground down to the designated thickness, and then the protective tape is removed from the wafer surface.

EP1170088A3 - Semiconductor wafer grinding method and ...

Disco Corp Original Assignee Disco Corp Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) 2000-07-04 Filing date 2001-07-03 Publication date 2002-01-30

Dicing-Grinding Service by DISCO - dicing-grinding service

Dicing-Grinding Service at DISCO EUROPE. DGS takes over any dicing/grinding/polishing task for semiconductor production as a supply chain partner for application support/improvement, prototype development or mass manufacturing. Using DISCO precision tools, we achieve highest quality, innovation and 100 % customer satisfaction.

Dicing Before Grinding (DBG) | DISCO Technology …

In DBG, first a half-cut is performed on the wafer with a dicing saw. Then, wafer thinning and die separation are performed at the same time during grinding. Because the thinned wafers are never transferred in DBG, wafer-level breakage is greatly reduced.

DISCO CORPORATION (6146.T) Company Profile & Facts - …

Description. Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. Its precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation.

Dicing and Grinding Using the ... - Disco Corporation

Process Workflow 1: Processing by Each Equipment (Stand-Alone) (Each step is performed by stand-alone equipment) Protective tape (BG tape for backside grinding) is laminated onto the wafer surface’s circuit, the backside of the wafer is ground down to the designated thickness, and then the protective tape is removed from the wafer surface.

Disco Corporation | Production Equipment | Japan

Disco Corporation 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580 +81 3 45901111: www.disco.co.jp Japan : Staff Information No. Staff ... Wafer Grinding Equipment, Wafer Polishing Machine Last Update 10 Apr 2020 ...

DISCO precision machines - dicing-grinding service

Best Equipment for advanced Dicing-Grinding Service. DISCO’s high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.

Processing of the Sealing Resin and Mold Resin X Grinding ...

In recent years, wafer-level CSP (Chip Size Packages) are sealed at the wafer level. Thus, in addition to DISCO dicing saws for singluation, DISCO grinders (grinding equipment using grinding wheels) for the low-profiling of sealing resin are also often used.

EP1170088A3 - Semiconductor wafer grinding method and ...

Disco Corp Original Assignee Disco Corp Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) 2000-07-04 Filing date 2001-07-03 Publication date 2002-01-30

GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING …

Apr 08, 2020· Global Semiconductor Wafer Polishing and Grinding Equipment Market Overview: The Global Semiconductor Wafer Polishing and Grinding Equipment Market was valued at USD 355.54 million in 2019, and it is expected to reach 452.57 million by 2025, registering a CAGR of 4.1% during the forecast period (2020 – 2025).

Thin Wafer Processing and Dicing Equipment Market | …

TAIKO, developed by DISCO Corporation, is a wafer back grinding process that uses a new grinding method. It is used for reducing the risk of thin wafer handling and lowering the warpage. The grinding process in TAIKO leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference.